Adding more layers in packages is making it difficult, and sometimes impossible, to inspect wire bonds that are deep within the different layers. Wire bonds may seem like old technology, but it ...

Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...

The growing amount of electronics within modern vehicles has made the inspection process for wire bonds increasingly challenging, as active devices shrink and bonds are arranged in complex ways.

Keysight Technologies, Inc. KEYS recently launched the Electrical Structural Tester (“EST”) to efficiently conduct wire bond inspection for semiconductor manufacturing. Designed for high-volume ...

July 12, 2013. Nordson YESTECH showcased its latest generation M1m AOI system July 9-11 at SEMICON West. Nordson YESTECH’s M1m is designed for automated inspection of advanced microelectronics and ...