Path to Systems - No 3: This article provides insights into how the design and manufacturing process of system-in-package technology will extend Moore’s vision, creating Moore’s law 2.0.

Renesas Technology Europe has announced its SiP Top-Down Design Environment to boost efficiency when developing system in package (SiP) products combining multiple chips, such as system on chip (SoC) ...

SANTA CRUZ, Calif. — Many tools support signal-integrity or power analysis for chips, packages or boards individually, but analyzing them all together is a challenge. Optimal Corp. this week will ...

System-in-a-package technology fulfills the need for high-density, small-footprint products with short turnaround times by using low-cost, standard assembly equipment. Shorter development times and ...

Renesas Technology has announced its SiP Top-Down Design Environment to boost efficiency when developing system in package (SiP) products combining multiple chips, such as system on chip (SoC) devices ...

The SiP Flow help designers ensure component design success with accurate and systematic analysis of inter-die and package effects Hsinchu, Taiwan -- July. 27, 2009 --Global Unichip Corp. (GUC; TW: ...

The system-on-chip (SoC) is arguably the biggest misnomer of today’s electronics industry. The core integrated circuit may well have onboard much of the logic circuitry needed to support the needs of ...

A new ultra-dense system-in-package is reshaping how AI servers and datacenters approach secure infrastructure. By fusing ...

System-in-Package (SiP) technology has begun to challenge SoC implementations as a high-level design strategy for selected wireless applications because of lengthening SoC design cycles and other ...