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New 5nm AMD Ryzen Threadripper 7000 saves upto 27 minutes/hour of ...
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Towards 90% of cars connected in 2028: what are the driving forces?
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DVCON India 2023: Chip design verification in AI driven 3nm E…
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Semiconductor based automotive sensors to grow 10% CAGR 2022-28

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BNN implementation using memristors is accurate and efficient than CMOS ...
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Intel to invest up to $4.6 billion to build semiconductor ATMP facility ...
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The new Snapdragon 8 Gen 3: AI superman in a smartphone SoC chip
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ABB no-code Wizard Easy Programming to support industri…

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India based Virtual Forest uses Navitas GaN devices in its solar ...
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3D stacking of an AlGaN/GaN/Si HEMT on CPW lines fabricated o…
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DVCON India 2023: Chip design verification in AI driven 3nm EDA era
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The new Snapdragon 8 Gen 3: AI superman in a smartphone So…

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Emerging markets such as India driving smartwatch market in 2023-24
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Imec Expands in the US: Opens a lab at Purdue and MoU with University ...
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Intel unveils Gaudi 3 AI processor, an alternative to Nvidia H100
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IBM unveiled its first modular quantum computer powered by 13…

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Chip design EDA: The three popular and latest P&R tools for …
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GOWIN launches GW5AT-15 FPGA for high-speed 4K video display in…
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India Semiconductor Mission organized SemiconIndia 2023 to start on ...
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1 µF ceramic capacitor in a tiny 1608M SMT package

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Applied and CEA-Leti collaborate on a joint lab to develop specialty ...
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FutureTech: Your semiconductor chips made in Space-shuttle, Moon or Mars
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Littelfuse announce AEC-Q200 Rev E qualified fuse…
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Japan to pull global semiconductor investment to counter China

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Breakthrough 22nm SOI-CMOS IC with on-chip antenna for sub-Terahertz ...
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Heterogenous SoC design: Chiplet architecture design: Use open-s…
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Semiconductor tech by NVIDIA at GTC: GB200 super GPU chip an…
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New 5nm AMD Ryzen Threadripper 7000 saves upto 27 minutes/hour of ...

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AMD new Spartan UltraScale+ FPGA cons…
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Intel to invest € 30B to setup angstrom-scale chipfab in Germany, calls ...
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Semiconductor centric Digital India FutureLABS launched by MeitY
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Germanium Tin alloy as channel material for

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Semiconductor device revenue for mobile and consumer reached $296 ...
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Applied's new deposition, CMP, CVD, PVD, and PECVD semiconductor ...
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NCJ29D6B, the next-gen UWB device for secure car access and more from NXP

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